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OARS-3
Open Air Sense Resistors Metal Alloy Strip
* * * * * * Higher than standard 1 Watt rating for 2512 pad design Zero ohm jumper available Economical low resistance SMT Resistance values 2m to 15m 1% or 5% tolerance (0.002 5% only) Open air design provides cooler operation
Electrical Data
IRC Type Power Rating (watts) Available Resistance (ohms) .002, .003, .004, .005, .010, .015
OARS-3
3W @ 70C
*Contact factory for unlisted resistance values between 0.002 & 0.050 ohms.
Features: * Superior thermal expansion cycling * Flameproof * Inductance less than 10 nanohenries * Lead flexible for thermal expansion
Applications: * Current sensing * Feedback * Low inductance * Surge and pulse * AC applications (please contact the factory)
Physical Data
L
Recommended Landing Pad Size
0.369 W 0.121 0.127 0.121
0.126 D T H
Dimensions (Inches and (mm)) IRC Type OARS-3 OARS-3 0.002 OARS-3 0.003
General Note
IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC's own data and is considered accurate at time of going to print.
L 0.440 0.015 (11.18 0.381) 0.455 .015 (11.56 .381 ) 0.440 .015 (11.18 .381 )
H 0.120 0.030 (3.05 0.762) 0.150 0.030 (3.51 0.762) 0.138 0.030 (3.51 0.762)
T 0.093 0.010 (2.36 0.254) 0.093 0.010 (2.36 0.254) 0.093 0.010 (2.36 0.254)
D 0.190 0.030 (4.83 0.762) 0.185 0.030 (4.70 0.762) 0.190 0.030 (4.83 0.762)
W 0.125 0.015 (3.175 0.381) 0.140 0.015 (3.56 0.381) 0.125 0.015 (3.175 0.381)
Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com
A Subsidiary of TT electronics plc February 2009 Issue Page 1 of 4
OARS-3
Open Air Sense Resistors Metal Alloy Strip
Environmental Data
Test Spec: AEC Q200 TCR +125 to -55C Thermal Shock High Temperature Exposure 125C Temperature Cycling: -40 to +125C Operational Life Baised Humidity Mechanical Shock Vibration Moisture Resistance Terminal Strength Solvent Resistance Solderability 2m - 3m 240ppm <0.75% <1.75% <1.0% <2.0% <0.75% <1.5% <1.0% <1.0 Meets JIS-C-6429 Meets MIL-STD-202 Method 215 Meets J-STD-002 Method B 4m - 15m 40ppm <0.75% <0.5% <1.0% <1.0% <0.5% <1.0% <1.0% <2.5%
Power Derating Curve
3.5
3.0 Power Rating (watts)
Note:
The power derating curve is a guidance based on a conservative design model. The OARS is a solid metal alloy construction that can withstand significantly greater operating temperatures than conservative design models permit. The resistive alloys can withstand temperatures in exess of 350C. Therefore, the system thermal design is a more significant design parameter due to the heat limitations of solder joints and/or circuit board substrate materials. Refer to additional information below.
2.5
2.0
1.0 0.0 25
60
95
130
165
195
225
Ambient Temperature (C)
The thermal image (not a simulation) to the left is of an OARS 5 m running at 4 Watts, which exceeds the 1 Watt conservative model. Notice the hotpsot is nearly 230C, but the solder joint is approximately 110C (FR4 is rated for 130C). The unique construction of the OARS isolates the hotspot from the circuit board material preventing damage. Additionally, the thermal energy is dissipated to the air instead of being conducted into the circuit board potentially causing a nearby power component to exceed its rating. The standard test circuit board consists of a four layer FR4 material with 2 ounce outer layers and 1 ounce inner layers, which is typical of many industry designs. Contact IRC for more details or for other thermal image test data for specific resistance values and power levels.
OARS R005 Thermal Image @ 4 Watts Ambient conditions, No forced air.
Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com
February 2009 Issue Page 2 of 4
OARS-3
Open Air Sense Resistors Metal Alloy Strip
Pulse/Surge Chart
70 60
Note:
The high pulse/surge capability of the OARS parts is attributed to the solid metal alloy construction. In many applications the cross-section of the OARS is greater than the cross-section of the board traces connecting the parts to the circuit board. Cross-Sectional area ranges from approximately 780 mils to 3600 mils.
Joules (watts-second)
50 40 30 20 10 0 0 5 10 15 20
Resistance (milli ohms)
Tape Specifications
G E
C
D
B A F
Dimensions (Inches and (mm)) IRC Type OARS-3 A 0.17 0.003 (4.32 0.08) B 0.461 0.003 (11.7 0.08) C 0.945 0.010 (24.0 0.30) D 0.453 0.004 (11.5 0.10) E 0.069 0.004 (1.75 0.10) F 0.315 0.004 (8.0 0.10) G 0.157 0.004 (4.0 0.1)
Ordering Data
Sample Part No. IRC Type
OARS3
OARS3
R005
J
LF
Power Rating in Watts Resistance Range (ohms) Tolerance
F = 1%, G = 2%, J = 5%
RoHS Indicator
LF indicates RoHS compliance
Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com
February 2009 Issue Page 3 of 4
OARS-3
Open Air Sense Resistors Metal Alloy Strip
IRC Solder Reflow Recommendations
Sn-Pb Eutectic and Pb-Free Reflow Profiles
tP TP
Ramp-up Critical Zone TL to TP
TL
Temperature
Tsmax
tL
Tsmin ts Preheat
Ramp-down
25
t 25C to Peak
Time
* Based on Industry Standards and IPC recommendations
Profile Feature
Average Ramp-up rate (Tsmax to Tp) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) Time maintained above - Temperature (TL) - Time (tL) Peak Temperature (TP) Ramp-down Rate Time 25C to Peak Temperature Time within 5C of actual Peak Temperature (tp)2
Sn-Pb Eutectic Assembly
3C / second max. 100C 150C 60 -120 seconds 183C 60 - 150 seconds See Table 1 10 - 30 seconds 6C / second max. 6 minutes max.
Pb-Free Assembly
3C / second max. 150C 200C 60 -180 seconds 217C 60 - 150 seconds See Table 2 20 - 40 seconds 6C / second max. 8 minutes max.
Note 1: All temperatures refer to topside of the package, measured on the package body surface. Note 2: Time within 5 C of actual peak temperature (tp) specified for the reflow profiles is a "supplier" minimum and a "user" maximum.
Tabel 1: SnPb Eutectic Process Package Peak Reflow Temperatures
Package Thickness < 2.5 mm 2.5 mm Volume mm3 < 350 240 +0/-5C 225 +0/-5C Volume mm3 350 225 +0/-5C 225 +0/-5C
Note 1: Package volume excludes external terminals (balls, bumps, lands, leads) and/or non-integral heat sinks. Note 2: The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processess reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist. Note 3: Components intended for use in "leadfree" assembly process shall be evaluated using the "lead-free" peak temperature and profiles defined in Table 1, 2 and reflow profile whether or not lead-free.
Tabel 2: Pb-free Process Package Peak Reflow Temperatures
Package Thickness < 1.6 mm 1.6 mm - 2.5 mm 2.5 mm Volume mm3 < 350 260C * 260C * 250C * Volume mm3 350 - 2000 260C * 250C * 245C * Volume mm3 > 2000 260C * 245C * 245C *
* Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature at the rated MSL level.
Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com
February 2009 Issue Page 4 of 4

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